In advanced semiconductor manufacturing processes, specialty gases such as NF₃, N₂O, and CF₄ are widely used for etching and chamber cleaning applications. While these gases help improve process efficiency and yield, their downstream treatment also presents significant challenges.
When these process gases are treated by local scrubbers through high-temperature combustion or plasma decomposition, oxidation reactions during the treatment process can easily generate nitrogen oxides, commonly known as NOx. As a result, NOx generated from exhaust gas treatment systems has become one of the important sources of air pollution in semiconductor facilities.
NOx not only contributes to acid rain and air quality deterioration, but also poses potential risks to human health. It has therefore become a key focus of environmental regulations worldwide.
Accordingly, how to effectively eliminate NOx generated by local scrubbers while maintaining exhaust gas treatment performance has become an important issue for the semiconductor industry as it moves toward safer and more sustainable operations.
Toplus’ DNX De-NOx module adopts a compact modular design and can be configured as either an embedded or external add-on module according to customer requirements. It is designed for easy integration with local scrubber systems, providing an efficient solution for eliminating NOx generated during exhaust gas treatment.
By reducing NOx emissions from local scrubber exhaust, DNX helps customers lower emission loads, comply with environmental regulations, and enhance overall process safety. Actual test results show that NOx concentration can be reduced to N.D. (Not Detected).
In addition, DNX integrates Toplus’ DHC technology to further strengthen operational safety. The system has also passed relevant safety and explosion-proof certifications, ensuring safe and reliable operation.
